- Category Technical paper
- Related event International Congress : SIA POWERTRAIN & POWER ELECTRONICS // Digital Edition 2021 - 9 & 10 June 2021
- Edition SIA
- Date 06/29/2021
- Author Jacques FAVRE | aPSI3D, France // Antoine IZOULET | CEA, France // Jean-Pierre FRADIN | Icam, Toulouse site, France // Fabio COCCETTI & Bernardo COUGO | IRT Saint Exupery, France
- Language English
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Type PDF file (839.41 Ko)
(Downloadable immediately on receipt of online payment) - Number of pages 8
- Code R-2021-04-213
- Fee Free
Abstract: Intertwining electronics and cooling offers outstanding gains in power density. For SiC, aPSI3D‘s ultra-compact power module technology helps reduce die paralleling. Application-wise, this induces many benefits. Driving standardization from such a tiny device will maximize value-to-cost. The module assembly process responds to excellence in mechatronic design and processing. Thermal modelling and measurement have helped monitor material and process. The challenge of ramping up such a breakthrough technology is explained. The production line is foreseen with automatics and robotics as the unique solution to handle such a 3-dimensional assembly, while guaranteeing quality and full traceability. Whether such a line can be implemented in a high cost country is then discussed.