Competitive implementation of a high value power module assembly line in a high cost country English Free Members only

Abstract: Intertwining electronics and cooling offers outstanding gains in power density. For SiC, aPSI3D‘s ultra-compact power module technology helps reduce die paralleling. Application-wise, this induces many benefits. Driving standardization from such a tiny device will maximize value-to-cost. The module assembly process responds to excellence in mechatronic design and processing. Thermal modelling and measurement have helped monitor material and process. The challenge of ramping up such a breakthrough technology is explained. The production line is foreseen with automatics and robotics as the unique solution to handle such a 3-dimensional assembly, while guaranteeing quality and full traceability. Whether such a line can be implemented in a high cost country is then discussed.