European Processor Initiative (EPI) An approach for a future automotive eHPC semiconductor platform English Free

  • Category Technical paper
  • Related event International Congress : SIA CESA 5.0 - 5 & 6 December 2018
  • Subheading M.Kovac, D.Reinhardt, O.Jesorsky, M. Traub, J.M.Denis and P.Notton
  • Edition SIA
  • Date 01/07/2019
  • Language English
  • Type PDF file (300.04 Ko)
    (Downloadable immediately on receipt of online payment)
  • Number of pages 9
  • Code R-2018-04-01
  • Fee Free

In this paper we present a novel approach for a future automotive embedded high-performance computing (eHPC) platform. The platform is based on an European Processor Initiative (EPI), Common Platform (CP). This paper also gives an overview of the automotive industry's challenges and the general architectural aspects of EPI CP.