A new approach to power electronics system integration with enhanced cooling solutions English

As the power density of the inverters increase the requirements for improved cooling and more robust assembly technologies gets more accentuated.
Direct cooling of ceramic substrates with different metallization in combination with optimized IGBT technologies has proven a viable path to increase power density. As a result more flexible and compact power modules can be designed.
Concept studies have shown that the use of double sided cooled modules and direct cooling of the integrated ceramic substrate have potential to bring up to 40% foot print reduction of the power module for a given power level compared to state of the art one sided cooled modules. This paper compares different realisation concepts for such modules.


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