- Catégorie Article technique
- Édition SIA
- Date 14/04/2015
- Auteur Christian RÖSSLE, Thomas GOTTWALD - Schweizer Electronic
- Langue Anglais
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Format Fichier PDF (588.85 Ko)
(livraison exclusivement par téléchargement) - Nombre de pages 6
- Code R-2015-05-17
- Prix Gratuit
Miniaturization of Power Electronic modules requires the minimization of losses and optimized power dissipation. The p² Pack technology makes it possible to build ultra-thin modules with a thickness of 1- 1.4 mm which have less losses and improved power dissipation characteristics by using embedding technologies and processes of the Printed Circuit Board industry.