High Power Motors and DC/DC Converters enhanced with the System in PCB Technology: p² Pack® English Free Members only

  • Category Technical paper
  • Edition SIA
  • Date 04/14/2015
  • Author Christian RÖSSLE, Thomas GOTTWALD - Schweizer Electronic
  • Language English
  • Type PDF file (588.85 Ko)
    (Downloadable immediately on receipt of online payment)
  • Number of pages 6
  • Code R-2015-05-17
  • Fee Free

Miniaturization of Power Electronic modules requires the minimization of losses and optimized power dissipation. The p² Pack technology makes it possible to build ultra-thin modules with a thickness of 1- 1.4 mm which have less losses and improved power dissipation characteristics by using embedding technologies and processes of the Printed Circuit Board industry.