Innovative CooliR2™ Packaging Platform with Dual-side Cooling Advances HEVs and EVs English

  • Category Technical paper
  • Edition SIA
  • Date 04/03/2013
  • Author Jack MARCINKOWSKI - International Rectifier
  • Language English
  • Type PDF file (741.92 Ko)
    (Downloadable immediately on receipt of online payment)
  • Number of pages 9
  • Code R-2013-01-21
  • Fee from 8.00 € to 10.00 €

The paper presents the results of the development of new concept in high power semiconductor packaging technology intended for electric and hybrid-electric vehicle (EV and HEV) traction inverters. The paper discusses how the novel CooliR2™ wirebond-less, transfer-molded packaging platform being developed by International Rectifier eliminates the weaknesses of conventional packaging technologies and enables significant inverter system cost savings. Achieved improvements over traditional power module packaging technologies are discussed and the results such as approx. 80% increase in current rating of power modules, three to four times increase in power density and an order of magnitude improvement in power cycling capability are presented in the paper. The paper concludes that the CooliR2™ high power semiconductor packaging platform will revolutionize how the automotive traction inverters are built.


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