Introduction: View on the Market Revolution of Electric Mobility
Jochen Langheim, Chairman of the congress | STMicroelectronics
OEM KEYNOTES & MARKET VIEW Session chair: Jochen Langheim - STMicroelectronics |
09:00
Introduction: View on the Market Revolution of Electric Mobility Jochen Langheim, Chairman of the congress | STMicroelectronics |
09:10
Automotive Electronics: Opportunities & Threats Ian Riches, Director - Automotive Practice | Strategy Analytics |
09:30
Vehicle Electrification at Peugeot Citroën Jean-Marc Finot, VP Research & Advanced Engineering | PSA Peugeot Citroën |
09:50
Opportunities for Electric Powertrain by increased Operation Voltage Wolfgang Wondrak, Hardware Power Electronics - Hardware & Charging Technology | Daimler |
10:10
Power Electronics Stakes for Vehicle Manufacturer Bertrand Largy, Expert Leader Electric Powertrain | Renault Nissan Alliance |
10:30
coffee break |
ELECTRIC AND HYBRID VEHICLES Architectures and Trends in Power Electronics and Drives Session chair: Daniel Richard - Valeo |
11:00
Introduction: Into Architectures and Trends in Power Electronics and Drives Daniel Richard, Group R&D Functional Excellence | Valeo |
11:10
General Trend in Electrification and Power Electronics from a Supplier Point of View Jürgen Bilo | Continental Automotive |
11:30
Valeo Electric Machines & Inverters Development Synergies for Hybrid and Electric Vehicles Philippe Farah | Valeo |
11:50
A Full SiC High Power High Frequency Drive for Motorsport Electrical Turbocharger Application Andrea Dappiano | Magneti Marelli |
12:10
Enhanced Flexibility of Inverter design by applying 2 in 1 Double Side Power Module Ryuichi Saito | Hitachi |
12:30
lunch break |
REVOLUTIONS IN POWER COMPONENTS Session chair: Thomas Harder | ECPE |
14:00
Introduction: Revolution in Power Components Thomas Harder, Managing Director | ECPE |
14:10
Great Potential of SiC Devices for Environmentally Friendly Vehicles Kimimori Hamada | Toyota Motor Corporation |
14:40
Practical Benefits at System Level using Wide Band Gap Materials in Next Electric Car Generations Jean-Benoît Moreau | STMicroelectronics |
14:55
High Power Density Automotive Converters using SiC or GaN Power Devices Bernd Eckardt | Fraunhofer IISB |
15:10
Questions & Answers - Panel discussions |
15:30
coffee break |
EVOLUTIONS IN PASSIVE AND PACKAGING Session chair: Jean-Michel Morelle - Valeo |
16:00
Introduction: Evolutions in Passives and Packaging Jean-Michel Morelle, Process & Advanced Technologies Delvelopments | Valeo |
16:10
High Power Motors and DC/DC Converters Enhanced with the System in PCB Technology: P² Pack ® Christian Rössle | Schweizer |
16:25
EMC Filter Solutions for High Voltage and Low Voltage Power Applications in Hybrid and Electric Vehicles Heiko Dalichau | Epcos (TDK) |
16:40
Integration of Active and Passives Components on Silicon or Glass Christian Nopper | STMicroelectronics |
16:55
Embedding of Power Semiconductors for Innovative Packages and Modules Lars Böttcher | Fraunhofer Institute-IZM |
17:10
Questions & Answers | Panel discussion |
18:00
Special address Jean Brunol, SIA president |
18:15
Cocktail in the exhibition |