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APRIL 6
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08:30
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Participants registration
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09:00
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Opening Speeches
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SESSION 1: OEM's vision
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09:10
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Evaluation of CO2 emissions reduction potential and customer acceptance of Plug in Hybrid Vehicles under real life operation
R. EL CHAMMAS - TOYOTA MOTOR EUROPE
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09:30
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Lifetime Prediction of Inverters Related to the Vehicle Applications
R. PLIKAT - VOLKSWAGEN
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09:50
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Modular and Scalable Power Electronics - Key Components for Future eDrive Systems
W. WONDRAK - DAIMLER
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10:10
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Key issues for EV mass market development
P. BASTARD - RENAULT
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10:30
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Round table with session 1 speakers
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10:45
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Break with exhibition visit
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SESSION 2: Research in the US
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11:15
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Keynote
Overview of the Advanced Power Electronics and Electric Machinery work within the USDOE Vehicle Technology Program
L. MARLINO - ORNL
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SESSION 3: Mechatronics integration
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11:45
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Keynote
Higher temperature power electronics for a larger-scale mechatronics integration
B. ALLARD, C. BUTTAY, D. TOURNIER, R. REBUTEL, J-F. MIGNOTTE, P. LAMELOT, D. BERGOGNE, C. MARTIN, H. MOREL - AMPERE
B. MORILLON, PH. GODIGNON - STMicroelectronics
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12:15
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Efficient packaging, integration and cooling of soft pouch Li cells into a high value energy storage system for (P)HEV applications
J. DUHR, L. BALZANO, V. WEISGERBER, R. BEER, K.J. HAWES, D. KRUGER - DELPHI
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12:35
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Packaging in Mechatronics approach
J. PUZO - AXON
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12:55
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Lunch and exhibition visit
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14:15
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Random SVM control of a voltage source inverter feeding a hybrid excited synchronous machine for hybrid/electric vehicle
E.H. MILIANI, L. KEFSI, Y. TOUZANI - IFP Energies Nouvelles
M. GABSI - SATIE ENS CACHAN
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14:35
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Shielding of Interference in Automotive Traction Grids
E. HOENE, T. NAPIERALA, A. DOMURAT-LINDE - FRAUNHOFER IZM
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14:55
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Round table with session 3 speakers
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SESSION 4: Power modules
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15:10
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Keynote
Driving e-Power toward automotive mass market acceptance
P. LETEINTURIER - INFINEON
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15:40
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Compact vehicle power electronics systems
P. NEWMAN, R. MÜHLEMANN - SEMIKRON
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16:00
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Application requirements for automotive power modules
C. CASTRO-SERRATO, T. REITER, D. GRAOVAC, A. CHRISTMANN - INFINEON
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16:20
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Custom Power under the Hood – High density IGBT module tuned to automotive mission profile
R. BREDTMAN, K. OLESEN, F. SÖHNCHEN - DANFOSS
R. EISELE - Kiel University of Applied Sciences
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16:40
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Round table with session 4 speakers
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16:55
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Break and exhibition visit
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SESSION 5: Passives Components
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17:15
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Keynote
Cooling to keep your Key Chips Alive
G. DIEMUNSCH - AAVID
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17:45
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Analysis on DC link filtering capacitor stress of an inverter for embedded systems
T.D. NGUYEN, N. PATIN, G. FRIEDRICH - UTC
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18:05
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DC Link Capacitor technology evolution for xEV applications
Mr. CHAPPAS - AVX
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18:25
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Meeting the challenge of a connector revolution
M. CUSSET - FCI
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18:45
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Round table with session 5 speakers
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19:00
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End of the day and exhibition visit
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20:00
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Networking dinner on the congress place
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APRIL 7
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SESSION 6 : Power systems
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09:00
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Keynote
Rethink the electrical vehicle architecture
L. DE SOUSA - VALEO
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09:30
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Optimized Voltage Range for Future Electric and Hybrid-Electric Vehicles
M. KOWAL, T. BLANK, M. SENOL, R.W. DE DONCKER - ISEA
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09:50
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Limiting the overshoot on IGBT during turn-off using stray inductance
J-M. CYR, M. EL-YACOUBI – TM4
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10:10
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Break and exhibition visit
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10:40
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Analysis of current bidirectional buck-boost based automotive switch-mode audio amplifier
G. B. MAIZONAVE, M.A.E. ANDERSEN, C. KJAERGAARD, K. L. LUND, L.B.R. HANSEN - Bang & Olufsen - DTU
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11:00
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Galvanic Isolated, Bi-directional Charger for EV
M. ROSEKEIT - ISEA
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11:20
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High Efficiency Inductive Charging of EVs
Mr. LASSLOP - LASSLOP GMBH
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11:40
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A new on-board fast battery charger
B. BOUCHEZ - VALEO
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12:00
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Round table with session 6 speakers
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12:15
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Lunch and exhibition visit
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SESSION 7: Semiconductor devices
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13:30
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Keynote
Power semiconductors for automotive applications
A. LINDEMANN - University of Magdeburg
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14:00
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MOSFETs for Start-Stop system in micro hybrid automobiles
S. RAI, A. GORGERINO - IR
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14:20
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GaN for power electronic and lighting enabled by MOCVD
F. SCHULTE, B. SCHINELLER, M. HEUKEN - AIXTRON
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14:40
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Comparison of high voltage MOSFET against IGBTs
G. VITALE - STMicroelectronics
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15:00
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Round table with session 7 speakers
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SESSION 8: Reliability & testing
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15:15
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Keynote
Robustness validation, a must in automotive power applications
W. KANERT - INFINEON
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15:45
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Control strategy to increase semiconductor lifetime within a three-phase VSI for traction applications using an induction machine
M. WECKERT, J. ROTH-STIELOW - STUTTGART UNIVERSITY
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16:05
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Cartography of full deformation fields in embedded electronic boards under thermo‐mechanical load with consequences on solder joint reliability
D. BORZA, I. TH. NISTEA - INSA ROUEN
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16:25
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Test method to predict EOS Field returns
E. PIEARAERTS, J-L. LEFEBVRE - PRESTO
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16:45
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High Power Trench MOSFET (LFET1T) High Power Reliability Assessment (HPRA) Characterization and Temperature Monitoring
J. CHEN, G. QIN, P. KU, D. ZUPAC, W. BU, P. WANG, E. DE FRESART - Freescale
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17:05
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Round table with session 8 speakers
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17:20
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End of conference
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Programme