- Category Technical paper
- Edition SIA
- Date 04/14/2015
- Author Christian RÖSSLE, Thomas GOTTWALD - Schweizer Electronic
- Language English
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Type PDF file (588.85 Ko)
(Downloadable immediately on receipt of online payment) - Number of pages 6
- Code R-2015-05-17
- Fee Free
Miniaturization of Power Electronic modules requires the minimization of losses and optimized power dissipation. The p² Pack technology makes it possible to build ultra-thin modules with a thickness of 1- 1.4 mm which have less losses and improved power dissipation characteristics by using embedding technologies and processes of the Printed Circuit Board industry.