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Description de l'événement |
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International Conference : APE
Paris - Paris
March 25 & 26, 2009
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MARCH 26th, 2009
PROGRAMME
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Session 3 : Mechatronic Integration
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08:30
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Keynote
Quality and reliability requirements for power electronics hardware
W. WONDRAK- Daimler
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09:00
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Keynote
Tools dedicated to the electromagnetic modeling of power structures
E. CLAVEL, V. ARDON- G2ELab, France
E. VIALARDI, M. LIONET- Cedrat, France
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09:30
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Polymer bonded soft magnetics for EMI-filter applications
S. EGELKRAUT, M. RAUCH, A. SCHLETS, M. MÄRZ - University of Erlangen-Nuremberg, Germany
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10:00
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DC/DC converter with improved rectification for higher efficiency
M. SALITERNIG - Continental, Germany
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10:30
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Exhibition and posters area Visit / Refreshment Break
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11:00
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Innovative connectivity for double side cooling and connection of power dice in the context of automotive power mechatronic packaging for a 100kVA inverter
JM. MORELLE- Valeo, France
L. DUPONT - INRETS - LTN, France
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11:30
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Power under the hood
R. BREDTMANN, K. OLESEN, F. OSTERWALD - Danfoss, Germany
R. EISELE - University of Applied Sciences, Germany
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12:00
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Perspectives of inverter integration in vehicle powertrains
A. SCHMIDHOFER, J. STARZINGER- Magna Steyr, Germany
M. MÄRZ, B. ECKARDT- IISB, Germany
Y. TADROS - Daimler, Germany
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12:30
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Exhibition and posters area Visit / Lunch
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13:45
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Dedicated Posters Session
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14:00
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Heatpipes for automotive power electronics cooling - results from the EU project HOPE
K. KRIEGEL, A. MELKONYAN, J. OTTO- Siemens AG, Germany
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14:30
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A novel multiple DC inputs direct electric power converter
K. YOSHIMOTO, K. MAIKAWA, S. SATO, M. ARIMITSU - Nissan, Japan
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15:00
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Novel power semiconductor device packaging for use in HEV, PHEV, EV and FCV power electronics applications V.
WEISGERBER, R. J. CAMPBELL, M. B. HAYES- Delphi, Luxemburg
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Session 4 : Semiconductors
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15:30
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Keynote
Semiconductors trends in electric and hybrid vehicles
J. LANGHEIM, H. SAX, N. ABBATE, JB. QUOIRIN- ST Microelectronics, France
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16:00
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IGBT- Chips in harsh operating conditions
U. KNIPPER, G. WACHUTKA - Institute for Physics of Electrotechnology, Germany
F. PFIRSCH, T. RAKER, J. NIEDERMEYR - Infineon, Germany
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16:30
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FMEA and lifetime estimation of power MOSFETs for ABS systems
A. TESTA, S. DE CARO, S. PANARELLO, S. PATANÈ - University of Messina, Italy
R. LETOR, S. RUSSO, D. PATTI- STMicroelectronics, Italy
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17:00
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Power MOSFET working in switching operating mode: study and analysis of the device’s switching time considering different operation conditions
G. CONSENTINO - ST Microelectronics, Italy
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End of conference |
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Programme